Photoresist Stripper | Envure ST™

Formulation Components for Photoresist Stripper Application

SACHEM  has developed Envure ST™ to help meet the growing performance, safety and quality standards for photoresist stripper application in the electronics industry.Photoresist Stripper

Envure ST™ delivers our non-aqueous formularies in various solvents for photoresist strippers, electronic surface cleaners, edge bead removers, and for microelectronic applications requiring little or no water.

These organic solvents have been carefully selected for low vapor pressure which minimizes emissions and concentration changes due to evaporation. Low contaminant levels make these compounds the ideal choice for extremely demanding applications requiring high purity and precision manufacturing.

Envure ST™ provides the following benefits:

  • Innovative hydroxide concentration in non aqueous environment to maximize photoresist stripping power
  • Resistant to galvanic corrosion
  • Microelectronic industry purity standards
  • Additive to current stripping formulations for decreased tool-time
  • Low corrosivity
  • Increased solubility of organic residues
  • Low metals
  • Low viscosity

Envure ST™  components for stripping applications requiring little or no water.

Envure ST™ 1051
Photoresist Stripper Formulary for IC
Tetrabutylammonium Hydroxide 40% Methanol
CAS# 2052-49-5/67-56-1
SDS
Envure ST™ 314
Photoresist Stripper Formulary for IC
Tetramethylammonium Hydroxide (TMAH) Pentahydrate Crystals
CAS# 10424-65-4
SDS
Envure ST™ 2012
Photoresist Stripper Formulary for IC
Tetramethylammonium Hydroxide (TMAH) 20% in PG
CAS# 57-55-6/75-59-2
SDS

Contact us to discuss alternative solvents that would be desirable to your specific formulation needs.

 

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