March 31, 2014 SACHEM, Inc. announced today that it will be a platinum sponsor of the SEMATECH SPCC in Austin, Texas. Experts will be on hand to provide an overview of SACHEM’s Envure System™, new solutions in In-Ga-Zn-O (IGZO) TFT and smooth silicon etching.
SACHEM has designed new wet chemical, damage-free etchants for IGZO-based TFT manufacturing. These proprietary formulations substantially increase the selective etching of the source/drain metals: aluminum, molybdenum, copper and titanium. The use of an etch stop layer to protect the IGZO channel is no longer required. This new solution will be the newest member of the Devera™ family of products.
SACHEM’s TSV Reveal Etch solution is specially designed for fast silicon etching and smooth surface finishing. This product has an etch rate 2-4 times faster than TMAH and KOH. This new solution is part of a portfolio of chemical components used by formulators creating wafer cleaning, stripping, selective etching, and photoresist developer chemical solutions for 3D packaging applications.
“SACHEM understands the challenges and opportunities facing formulated solution providers,” stated Kevin McLaughlin, Global Electronic Materials Marketing Manager, “and manufactures high purity components to enable these solutions. We also understand the need for partnership and collaboration in product development. Our success is built on these partnerships.”
SACHEM’s Envure System™ is a platform of aqueous and non-aqueous electronic formulation components and TMAH alternatives for precise and complex wafer cleaning, selective etching, photo-resist developing and stripping surface preparation needs. This, combined with SACHEM’s expertise in semiconductor chemistry and processes, enables the industry innovators to meet and exceed stringent market requirements.
SEMATECH Surface Preparation and Cleaning Conference (SPCC) is an annual event which brings together prominent researchers from the semiconductor industry and the university community to focus on the current developments and ITRS challenges in advanced wafer and mask cleaning and surface preparation technologies.
