Formulation Components for Photoresist Stripper Application
SACHEM has developed Envure ST™ to help meet the growing performance, safety and quality standards for photoresist stripper application in the electronics industry.
Envure ST™ delivers our non-aqueous formularies in various solvents for photoresist strippers, electronic surface cleaners, edge bead removers, and for microelectronic applications requiring little or no water.
These organic solvents have been carefully selected for low vapor pressure which minimizes emissions and concentration changes due to evaporation. Low contaminant levels make these compounds the ideal choice for extremely demanding applications requiring high purity and precision manufacturing.
Envure ST™ provides the following benefits:
- Innovative hydroxide concentration in non aqueous environment to maximize photoresist stripping power
- Resistant to galvanic corrosion
- Microelectronic industry purity standards
- Additive to current stripping formulations for decreased tool-time
- Low corrosivity
- Increased solubility of organic residues
- Low metals
- Low viscosity
Envure ST™ components for stripping applications requiring little or no water.
Photoresist Stripper Formulary for IC
Tetrabutylammonium Hydroxide 40% Methanol
CAS# 2052-49-5/67-56-1
Photoresist Stripper Formulary for IC
Tetramethylammonium Hydroxide (TMAH) Pentahydrate Crystals
CAS# 10424-65-4
Photoresist Stripper Formulary for IC
Tetramethylammonium Hydroxide (TMAH) 20% in PG
CAS# 57-55-6/75-59-2
Contact us to discuss alternative solvents that would be desirable to your specific formulation needs.
