SACHEM, Inc. has announced today that it will take part in the SCUGM Seminar, presenting a technical paper highlighting the advances made in FEOL selective ethcing and cleaning.  The paper will be delivered by SACHEM’s Applications Developement Manager, Russell Stevens

Austin, TX -September 12^th, 2007 – SACHEM, Inc. has announced today that it will be delivering a technical paper at The 6^th International SCUGM seminar. The seminar will take place September 19^th, 2007 in Seoul, Korea at the COEX Conference Center and will focus on the advancements being made to make the wafer manufacturing process cleaner and more efficient.  SACHEM will highlight its Front End of Line (FEOL) wet etch and selective cleaning technology in a paper delivered by Applications Development Manager, Russell Stevens.

SACHEM’s paper will focus on developments it has made in Front End-Of-Line (FEOL) wet etch selectivity and wafer cleaning applications.  The company has recognized the challenges that traditional oxide etches have presented in the past and has created a solution based on precision and purity.   In order for the company to meet demands for shorter cycle time, increased uniformity and defect reduction, it has focused on the integration of its chemistries with single wafer tool technology.  By using single wafer tool technology and by implementing its precision chemistry, focused on high selectivity, SACHEM can offer customers and development partners a product that will provide them  with an overall increased process performance.

SACHEM will also introduce SelectEtch^TM SE-1220, an advanced contact cleaner.  SelectEtch^TM SE-1220 represents a significant improvement in high-aspect-ratio contact clean performance. It successfully removes etch-generated residues from the bottom and sides of advanced contact features, achieving 1:1 selectivity between thermal oxides and lower density oxides such as BPSG and SOD. SE-1220’s chemical design and functionality allow it to remove residues while achieving outstanding surface roughness and maintaining critical dimensions, especially in complex film stacks.

Mark Stasney, Electronic Materials Marketing Manager of SACHEM, Inc., commented,  “SACHEM’S focus is on delivering products to our customers that will create opportunities that standard FEOL chemistries are not capable of.  The way we found to do that was to create a product that delivers outstanding selectivity and clean performance in FEOL applications. We are excited to offer process engineers our SelectEtch^TM products which provide the highest in selectivity performance as compared with standard FEOL chemistries.”