Overview Highlights Silicon Etching For Microelectronics

(Austin, TX) – July 15, 2008 – SACHEM has published an article titled, “Silicon Etching in Microelectronics: An Overview” on its website.  The white paper outlines information on silicon crystalline planes and the performance characteristics of standard etchants.

Mark Stasney, Electronics Marketing Manager at SACHEM, says, “Silicon etching can be performed by a number of different chemistries, depending on the nature, speed and application of the etch.  Extensive published data exists on isotropic and anisotropic etching of silicon, of which this paper represents but a small part.  However, in many applications where precision silicon etching is required in advanced microelectronics to create critical geometries, the standard etchants will not achieve the required performance. In response, SACHEM has developed a line of application-specific silicon etchants with improved selectivity relative to silicon crystalline planes.”

SACHEM, Inc. delivers highly pure, precise and innovative chemical solutions designed to solve the most demanding and challenging applications.  For over 50 years SACHEM has provided chemical solutions and services to customers in key markets including electronics, biotechnology, starch modification, polymers, catalysts, pharmaceutical and agricultural chemicals.  Based in Austin, Texas, SACHEM’s expanding worldwide operations include manufacturing and research facilities in North America, Europe and Asia with a global service network and presence spanning over 30 countries.